A process that divides a wafer into multiple semiconductor chips
wafer thickness increases from 100μm to 50μm, and then to 30μm, and thinner, the cutting method to obtain a separate chip is also changing and evolving from fr...
Continue Readingwafer thickness increases from 100μm to 50μm, and then to 30μm, and thinner, the cutting method to obtain a separate chip is also changing and evolving from fr...
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