What are the benefits of substrate PCB technology?

Under the general trend of the increasingly thin and light mobile phone market in the development of smart phones, 1oz vs 2oz the internal network space environment of mobile phone companies is getting smaller and smaller, and the competition of various components for the company's internal control space is becoming more and more fierce. Relatively speaking, the practice of reducing the battery capacity to provide learning space for other components is common, resulting in the spatial structure of the battery continues to shrink, but the ensuing battery life problem has also become a big worry for China's mobile phone manufacturers.

At present, there is no breakthrough in battery technology, and directly increasing battery capacity is the simplest and most effective way to extend battery life. So how to solve the contradiction between the internal space of the phone and the battery capacity? All that's left is to reduce the size of the other phone components.

In fact, substrate PCB technology is not a new technology. how to test a circuit board with a multimeter It has been used in industrial automation, power control equipment, elevator equipment, medical equipment and other fields for a long time, but it has not been widely used in the mobile phone industry.

The traditional PCB technology is to design a circuit on the printed circuit board to connect the wires and mounting holes, the lead of the traditional components through the hole on the circuit board, on the other side of the printed board is to conduct research and welding, and finally according to the components required for assembly work, composed of the required circuit design products. However, because these components have leads, when the circuit knowledge is dense to a certain extent, we can no longer reduce the different volumes. At the same time, it is difficult to effectively eliminate the fault caused by the relative proximity between the leads and the interference caused by the change of the length of the leads.

Substrate PCB technology refers to the structure of chip components or micro-components suitable for surface mount, according to the requirements of the circuit placed on the surface of the printed circuit board, the assembly technology of electronic components with certain functions is composed of reflow welding, wave soldering and other welding processes. Compared with the traditional PCB technology, it has the advantages of miniaturization, high signal transmission speed, good high-frequency characteristics, conducive to automated production and reduce production costs.

Compared with the now popular HDI(high density Interconnect) technology, substrate PCB technology can use more material layers while allowing smaller spacing between components (≤15nm), which greatly reduces the PCB volume and makes more room for the battery.